Log in
Sign up
Golden has been acquired by ComplyAdvantage.Read about it here ⟶
‌

US Patent 9613861 Damascene wires with top via structures

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
Date Filed
August 5, 2015
Date of Patent
April 4, 2017
Patent Application Number
14818419
Patent Citations Received
‌
US Patent 11670542 Stepped top via for via resistance reduction
0
‌
US Patent 11682617 High aspect ratio vias for integrated circuits
0
‌
US Patent 11709553 Automated prediction of a location of an object using machine learning
0
‌
US Patent 11961759 Interconnects having spacers for improved top via critical dimension and overlay tolerance
0
‌
US Patent 11804406 Top via cut fill process for line extension reduction
‌
US Patent 11854884 Fully aligned top vias
0
‌
US Patent 11894265 Top via with damascene line and via
0
‌
US Patent 11869808 Top via process with damascene metal
0
‌
US Patent 11923246 Via CD controllable top via structure
0
‌
US Patent 12062609 Electronic fuse structure embedded in top via
0
Patent Inventor Names
Brent A. Anderson
0
Edward J. Nowak
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
9613861
Patent Primary Examiner
‌
Phuc Dang

Find more entities like US Patent 9613861 Damascene wires with top via structures

Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
Open Query Tool
Access by API
Golden Query Tool
Golden logo