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US Patent 9704827 Hybrid bond pad structure

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
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Date Filed
June 25, 2015
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Date of Patent
July 11, 2017
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Patent Application Number
14750003
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Patent Citations Received
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US Patent 11764177 Bonded structure with interconnect structure
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US Patent 12068278 Processed stacked dies
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US Patent 12113056 Stacked dies and methods for forming bonded structures
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US Patent 12136605 Layer structures for making direct metal-to-metal bonds at low temperatures in microelectronics and method for forming the same
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US Patent 11804473 Hybrid bond pad structure
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US Patent 11955463 Direct bonded stack structures for increased reliability and improved yield in microelectronics
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US Patent 11967575 Bond enhancement structure in microelectronics for trapping contaminants during direct-bonding processes
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Patent Inventor Names
Sheng-Chau Chen
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Ching-Chun Wang
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Chun-Chieh Chuang
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Dun-Nian Yaung
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Feng-Chi Hung
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Sin-Yao Huang
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Yung-Lung Lin
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
9704827
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Patent Primary Examiner
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Mark Prenty
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