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US Patent 9735131 Multi-stack package-on-package structures

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
Date Filed
December 17, 2015
Date of Patent
August 15, 2017
Patent Application Number
14972622
Patent Citations Received
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US Patent 12136619 Methods of manufacturing three-dimensional integrated circuit structures
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US Patent 12125819 Die on die bonding structure
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US Patent 12131974 Semiconductor package and method of manufacturing semiconductor package
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US Patent 12132024 Semiconductor package and method of manufacturing the same
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US Patent 11664350 Semiconductor device and method of manufacture
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US Patent 11664286 Method for forming package structure
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US Patent 11664300 Fan-out packages and methods of forming the same
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US Patent 11670597 Method for forming package structure
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US Patent 11670621 Die stack structure
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US Patent 11676916 Structure and formation method of package with warpage-control element
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•••
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
9735131
Patent Primary Examiner
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Nitin Parekh

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