US Patent 9754365 Wafer inspection method and software
Patent 9754365 was granted and assigned to Applied Materials on September, 2017 by the United States Patent and Trademark Office.
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Patent abstract
Embodiments of the present invention generally relate to methods for inspecting wafers. After a brick is sliced into a plurality of bare wafers, a two-dimensional (2D) photoluminescence (PL) image of each wafer is taken, the PL images of the wafers in sequential order (i.e., the sequence of the wafers as they are sliced from the brick) are then combined to construct a three-dimensional (3D) model of the brick that highlights similar regions in the brick.
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Patent Inventor Names
Asaf Schlezinger0
Markus J. Stopper0
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US Patent 09754365 Wafer inspection method and software US Patent 9754365 Wafer inspection method and software
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Patent Number
097543650
Patent Number
97543650
Edits on 28 Mar, 2023
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Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
097543650
Date of Patent
September 5, 2017
0Patent Application Number
146094550
Date Filed
January 30, 2015
0Patent Primary Examiner
Edits on 14 Jan, 2022
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US Patent 09754365 Wafer inspection method and software
Infobox
Is a
Patent applicant
Current assignee
Patent jurisdiction
Patent number
09754365
Date of patent
September 5, 2017
Patent application number
14609455
Date Filed
January 30, 2015
Patent primary examiner
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