Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Daniel Hsieh0
Chee Key Chung0
Henry Su0
Jones Wang0
Plory Huang0
Ryan Ong0
Date of Patent
September 5, 2017
Patent Application Number
14581575
Date Filed
December 23, 2014
Patent Citations Received
0
...
Patent Primary Examiner
Patent abstract
An organic-inorganic hybrid structure is described for integrated circuit packages. In one example, an integrated circuit package includes a ceramic frame having a top side and a bottom side, the top side having a pocket with a bottom floor and a plurality of conductive through holes in the bottom floor, an integrated circuit die attached to the bottom floor over the conductive through holes, and a redistribution layer on the bottom side connected to the conductive through holes.
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