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US Patent 9893004 Semiconductor interposer integration

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
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Date Filed
May 20, 2015
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Date of Patent
February 13, 2018
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Patent Application Number
14717798
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Patent Citations Received
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US Patent 12136605 Layer structures for making direct metal-to-metal bonds at low temperatures in microelectronics and method for forming the same
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US Patent 12113056 Stacked dies and methods for forming bonded structures
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US Patent 12113054 Non-volatile dynamic random access memory
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US Patent 12125784 Interconnect structures
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US Patent 12132020 Low temperature bonded structures
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US Patent 11658173 Stacked dies and methods for forming bonded structures
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US Patent 11664357 Techniques for joining dissimilar materials in microelectronics
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US Patent 11664302 Integrated circuit module with a structurally balanced package using a bottom side interposer
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US Patent 11670615 Bonded structures
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US Patent 11694925 Diffusion barrier collar for interconnects
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•••
Patent Inventor Names
Farhang Yazdani
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
9893004
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Patent Primary Examiner
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Yuriy Semenenko
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