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US Patent 9953941 Conductive barrier direct hybrid bonding

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
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Date Filed
August 25, 2015
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Date of Patent
April 24, 2018
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Patent Application Number
14835379
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Patent Citations Received
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US Patent 12136605 Layer structures for making direct metal-to-metal bonds at low temperatures in microelectronics and method for forming the same
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US Patent 12113056 Stacked dies and methods for forming bonded structures
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US Patent 12113054 Non-volatile dynamic random access memory
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US Patent 12125784 Interconnect structures
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US Patent 12132020 Low temperature bonded structures
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US Patent 11658173 Stacked dies and methods for forming bonded structures
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US Patent 11664357 Techniques for joining dissimilar materials in microelectronics
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US Patent 11670615 Bonded structures
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US Patent 11694925 Diffusion barrier collar for interconnects
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US Patent 11710718 Structures and methods for low temperature bonding using nanoparticles
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•••
Patent Inventor Names
Paul M. Enquist
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
9953941
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Patent Primary Examiner
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Michelle Mandala
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