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US Patent 9972529 Method of forming metal interconnection

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
Date Filed
September 28, 2015
Date of Patent
May 15, 2018
Patent Application Number
14867872
Patent Citations Received
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US Patent 12125748 Contact plug
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US Patent 11658215 Method of forming contact structures
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US Patent 11935783 Selective deposition for integrated circuit interconnect structures
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US Patent 11916133 Self-aligned contact structures
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US Patent 11955535 Methods for forming air spacers in semiconductor devices
0
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US Patent 12009293 Barrier-free interconnect structure and manufacturing method thereof
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US Patent 12014987 Electro-migration reduction
0
Patent Inventor Names
Shin-Yi Yang
0
Ming-Han Lee
0
Shau-Lin Shue
0
Tz-Jun Kuo
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
9972529
Patent Primary Examiner
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Peniel M Gumedzoe

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