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US Patent D973116 Mainframe of substrate processing system

Patent D973116 was granted and assigned to Applied Materials on December, 2022 by the United States Patent and Trademark Office.

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Is a

Patent

Patent attributes

Patent Applicant

Applied Materials

Current Assignee

Applied Materials

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

D9731160

Patent Inventor Names

Michael C. Kuchar0

Travis Morey0

Ofer Amir0

Adam J. Wyatt0

Michael R. Rice0

Date of Patent

December 20, 2022

Patent Application Number

297586640

Date Filed

November 17, 2020

Patent Citations

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US Patent 10994480 Three-dimensional printer systems and methods

Patent Citations Received

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US Patent D1029066 Mainframe of dual-robot substrate processing system

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US Patent D991994 Mainframe of substrate processing system

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US Patent D992611 Mainframe of substrate processing system

Patent Primary Examiner

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