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US Patent D973116 Mainframe of substrate processing system

Patent D973116 was granted and assigned to Applied Materials on December, 2022 by the United States Patent and Trademark Office.

OverviewStructured DataIssuesContributors
Is a
Patent
Patent
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Current Assignee
Applied Materials
Applied Materials
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Date Filed
November 17, 2020
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Date of Patent
December 20, 2022
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Patent Applicant
Applied Materials
Applied Materials
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Patent Application Number
29758664
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Patent Citations
‌
US Patent 10994480 Three-dimensional printer systems and methods
Patent Citations Received
‌
US Patent D1029066 Mainframe of dual-robot substrate processing system
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US Patent D991994 Mainframe of substrate processing system
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US Patent D992611 Mainframe of substrate processing system
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Patent Inventor Names
Michael C. Kuchar
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Travis Morey
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Ofer Amir
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Adam J. Wyatt
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Michael R. Rice
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
D973116
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Patent Primary Examiner
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Patricia A Palasik
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CPC Code
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H01L 21/68707
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