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US Patent 10002844 Bonded structures

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
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Date Filed
December 21, 2016
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Date of Patent
June 19, 2018
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Patent Application Number
15387385
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Patent Citations Received
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US Patent 12136605 Layer structures for making direct metal-to-metal bonds at low temperatures in microelectronics and method for forming the same
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US Patent 12074092 Hard IP blocks with physically bidirectional passageways
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US Patent 12113054 Non-volatile dynamic random access memory
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US Patent 12125784 Interconnect structures
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US Patent 12132020 Low temperature bonded structures
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US Patent 11515291 Integrated voltage regulator and passive components
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US Patent 11515202 3D IC method and device
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US Patent 11515279 Low temperature bonded structures
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US Patent 10269708 Increased contact alignment tolerance for direct bonding
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US Patent 10276909 Structure comprising at least a first element bonded to a carrier having a closed metallic channel waveguide formed therein
•••
Patent Inventor Names
Javier A. DeLaCruz
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Arkalgud R. Sitaram
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Liang Wang
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Rajesh Katkar
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
10002844
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Patent Primary Examiner
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Jasmine Clark
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