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US Patent 10075657 Edgeless large area camera system

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
Date Filed
July 20, 2016
Date of Patent
September 11, 2018
Patent Application Number
15214933
Patent Citations Received
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US Patent 12136605 Layer structures for making direct metal-to-metal bonds at low temperatures in microelectronics and method for forming the same
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US Patent 11476213 Bonded structures without intervening adhesive
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US Patent 12068278 Processed stacked dies
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US Patent 12074092 Hard IP blocks with physically bidirectional passageways
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US Patent 12080672 Direct gang bonding methods including directly bonding first element to second element to form bonded structure without adhesive
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US Patent 12113054 Non-volatile dynamic random access memory
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US Patent 12113056 Stacked dies and methods for forming bonded structures
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US Patent 12125784 Interconnect structures
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US Patent 12132020 Low temperature bonded structures
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US Patent 11462419 Microelectronic assemblies
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•••
Patent Inventor Names
Piotr Maj
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Joseph Mead
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Pawel Grybos
0
Piotr Kmon
0
Robert Kent Bradford
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Robert Szczygiel
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Abdul Khader Rumaiz
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David Peter Siddons
0
Farah Fahim
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Grzegorz W. Deptuch
0
•••
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
10075657
Patent Primary Examiner
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Kenneth J Malkowski

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