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US Patent 10083863 Contact structure for semiconductor device
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Patent
1
Date Filed
August 23, 2017
1
Date of Patent
September 25, 2018
1
Patent Application Number
15684257
1
Patent Citations Received
US Patent 12125748 Contact plug
2
US Patent 11502031 Multiple layer metal-insulator-metal (MIM) structure
US Patent 11309393 Integrated circuit device including an overhanging hard mask layer
US Patent 11776847 Contact structure for semiconductor device
US Patent 11362196 Semiconductor device having a ring-shaped protection spacer enclosing a source/drain contact plug
US Patent 11367651 Semiconductor device
US Patent 11804528 Semiconductor device
US Patent 11393910 Semiconductor device and formation method thereof
US Patent 11855154 Vertical interconnect features and methods of forming
11
US Patent 11972974 Self-aligned barrier for metal vias
12
•••
Patent Inventor Names
Yi-Wei Chiu
1
Cha-Hsin Chao
1
Jeng Chang Her
1
Li-Te Hsu
1
Ying Ting Hsia
1
Yun-Yu Hsieh
1
Patent Jurisdiction
United States Patent and Trademark Office
1
Patent Number
10083863
1
Patent Primary Examiner
Thien F. Tran
1
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