US Patent 10109490 Cobalt interconnects formed by selective bottom-up fill
Is a
Date Filed
June 20, 2017
0
Date of Patent
October 23, 2018
0
Patent Application Number
15627879
0
Patent Citations Received
Patent Inventor Names
Sean X. Lin
0
Xunyuan Zhang
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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