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US Patent 10269708 Increased contact alignment tolerance for direct bonding

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
Date Filed
December 22, 2017
Date of Patent
April 23, 2019
Patent Application Number
15853085
Patent Citations
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US Patent 10002844 Bonded structures
Patent Citations Received
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US Patent 12136605 Layer structures for making direct metal-to-metal bonds at low temperatures in microelectronics and method for forming the same
0
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US Patent 12125784 Interconnect structures
0
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US Patent 11515279 Low temperature bonded structures
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US Patent 11552041 Chemical mechanical polishing for hybrid bonding
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US Patent 10840205 Chemical mechanical polishing for hybrid bonding
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US Patent 11244920 Method and structures for low temperature device bonding
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US Patent 11011494 Layer structures for making direct metal-to-metal bonds at low temperatures in microelectronics
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US Patent 11610846 Protective elements for bonded structures including an obstructive element
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US Patent 11710718 Structures and methods for low temperature bonding using nanoparticles
0
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US Patent 11749645 TSV as pad
•••
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
10269708
Patent Primary Examiner
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Jasmine J Clark

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