Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
February 8, 2022
Patent Application Number
16715532
Date Filed
December 16, 2019
Patent Citations
...
Patent Citations Received
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Patent Primary Examiner
Patent abstract
Dies and/or wafers including conductive features at the bonding surfaces are stacked and direct hybrid bonded at a reduced temperature. The surface mobility and diffusion rates of the materials of the conductive features are manipulated by adjusting one or more of the metallographic texture or orientation at the surface of the conductive features and the concentration of impurities within the materials.
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