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US Patent 11244920 Method and structures for low temperature device bonding

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Edits on 30 Oct, 2024
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edited on 30 Oct, 2024
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US Patent 12132020 Low temperature bonded structures
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Edits on 9 Oct, 2024
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edited on 9 Oct, 2024
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US Patent 12113056 Stacked dies and methods for forming bonded structures
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edited on 9 Oct, 2024
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US Patent 12113054 Non-volatile dynamic random access memory
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Edits on 29 Aug, 2024
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edited on 29 Aug, 2024
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US Patent 12074092 Hard IP blocks with physically bidirectional passageways
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Edits on 22 Aug, 2024
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Golden AI
edited on 22 Aug, 2024
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US Patent 12068278 Processed stacked dies
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Edits on 31 Jul, 2024
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Edits on 24 Jul, 2024
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Edits on 3 Jul, 2024
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edited on 3 Jul, 2024
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US Patent 12027487 Structures for low temperature bonding using nanoparticles
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Edits on 8 May, 2024
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edited on 8 May, 2024
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edited on 8 May, 2024
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US Patent 11978724 Diffused bitline replacement in memory
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Edits on 1 May, 2024
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edited on 1 May, 2024
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US Patent 11973056 Methods for low temperature bonding using nanoparticles
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Edits on 24 Apr, 2024
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edited on 24 Apr, 2024
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edited on 10 Apr, 2024
Edits on 14 Mar, 2024
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edited on 14 Mar, 2024
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US Patent 11929347 Mixed exposure for large die
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Edits on 2 Mar, 2024
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Golden AI
edited on 2 Mar, 2024
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US Patent 11916054 Stacked devices and methods of fabrication
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Edits on 22 Feb, 2024
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Golden AI
edited on 22 Feb, 2024
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US Patent 11908739 Flat metal features for microelectronics applications
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Edits on 9 Feb, 2024
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Golden AI
edited on 9 Feb, 2024
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US Patent 11894345 Integrated voltage regulator and passive components
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Golden AI
edited on 9 Feb, 2024
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US Patent 11894326 Multi-metal contact structure
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