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US Patent 10347515 Method for manufacturing workpieces and apparatus

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
Date Filed
August 6, 2014
Date of Patent
July 9, 2019
Patent Application Number
14452883
Patent Citations
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US Patent 10103046 Buffer chamber wafer heating mechanism and supporting robot
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US Patent 10186441 Substrate processing apparatus and substrate processing method
Patent Citations Received
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US Patent 12080571 Substrate processing module and method of moving a workpiece
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US Patent 12002668 Thermal management hardware for uniform temperature control for enhanced bake-out for cluster tool
0
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US Patent 12074042 High-density substrate processing systems and methods
0
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US Patent 11574826 High-density substrate processing systems and methods
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US Patent 10998209 Substrate processing platforms including multiple processing chambers
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US Patent 11590662 Robot for simultaneous substrate transfer
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US Patent 11600507 Pedestal assembly for a substrate processing chamber
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US Patent 11610799 Electrostatic chuck having a heating and chucking capabilities
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US Patent 11674227 Symmetric pump down mini-volume with laminar flow cavity gas injection for high and low pressure
0
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US Patent 11749542 Apparatus, system, and method for non-contact temperature monitoring of substrate supports
•••
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
10347515
Patent Primary Examiner
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Rudy Zervigon

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