Log in
Sign up
Golden has been acquired by ComplyAdvantage.Read about it here ⟶
‌

US Patent 10434749 Method of room temperature covalent bonding

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
Date Filed
September 2, 2014
Date of Patent
October 8, 2019
Patent Application Number
14474501
Patent Citations Received
‌
US Patent 12132020 Low temperature bonded structures
0
‌
US Patent 12068278 Processed stacked dies
0
‌
US Patent 11515279 Low temperature bonded structures
‌
US Patent 10971472 Method of liquid assisted bonding
‌
US Patent 11710718 Structures and methods for low temperature bonding using nanoparticles
0
‌
US Patent 11894326 Multi-metal contact structure
0
‌
US Patent 11908739 Flat metal features for microelectronics applications
0
‌
US Patent 11967575 Bond enhancement structure in microelectronics for trapping contaminants during direct-bonding processes
0
‌
US Patent 11973056 Methods for low temperature bonding using nanoparticles
0
‌
US Patent 12027487 Structures for low temperature bonding using nanoparticles
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
10434749
Patent Primary Examiner
‌
Philip C. Tucker

Find more entities like US Patent 10434749 Method of room temperature covalent bonding

Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
Open Query Tool
Access by API
Golden Query Tool
Golden logo