Log in
Sign up
Golden has been acquired by ComplyAdvantage.Read about it here ⟶
‌

US Patent 10570257 Copolymerized high temperature bonding component

Patent 10570257 was granted and assigned to Applied Materials on February, 2020 by the United States Patent and Trademark Office.

OverviewStructured DataIssuesContributorsActivity

All edits

Edits on 11 Sep, 2024
"update inverses"
Golden AI profile picture
Golden AI
edited on 11 Sep, 2024
Edits made to:
Infobox (+1 properties)
Infobox
Patent Citations Received
‌
US Patent 12087679 Package core assembly and fabrication methods
0
Edits on 31 Jul, 2024
"update inverses"
Golden AI profile picture
Golden AI
edited on 31 Jul, 2024
Edits made to:
Infobox (+1 properties)
Infobox
Patent Citations Received
0
Edits on 21 Mar, 2024
"update inverses"
Golden AI profile picture
Golden AI
edited on 21 Mar, 2024
Edits made to:
Infobox (+1 properties)
Infobox
Patent Citations Received
‌
US Patent 11931855 Planarization methods for packaging substrates
0
Edits on 14 Mar, 2024
"update inverses"
Golden AI profile picture
Golden AI
edited on 14 Mar, 2024
Edits made to:
Infobox (+1 properties)
Infobox
Patent Citations Received
‌
US Patent 11927885 Fluoropolymer stamp fabrication method
0
Edits on 1 Feb, 2024
"update inverses"
Golden AI profile picture
Golden AI
edited on 1 Feb, 2024
Edits made to:
Infobox (+1 properties)
Infobox
Patent Citations Received
‌
US Patent 11887934 Package structure and fabrication methods
0
Edits on 30 Jan, 2024
"update inverses"
Golden AI profile picture
Golden AI
edited on 30 Jan, 2024
Edits made to:
Infobox (+1 properties)
Infobox
Patent Citations Received
‌
US Patent 11881447 Package core assembly and fabrication methods
0
Edits on 4 Jan, 2024
"update inverses"
Golden AI profile picture
Golden AI
edited on 4 Jan, 2024
Edits made to:
Infobox (+1 properties)
Infobox
Patent Citations Received
‌
US Patent 11862546 Package core assembly and fabrication methods
0
Edits on 11 Dec, 2023
"Add patent abstract"
Golden AI profile picture
Golden AI
edited on 11 Dec, 2023
Edits made to:
Article (+334 characters)
Article

Patent abstract

A copolymerized high temperature bonding component that includes a first amount of an organofluorine polymer and a second amount of an organosilicon polymer which are chemically bound to each other to form a copolymer. The bonding component may have properties that allow it to be used for binding dissimilar materials.

Edits on 7 Dec, 2023
"update inverses"
Golden AI profile picture
Golden AI
edited on 7 Dec, 2023
Edits made to:
Infobox (+1 properties)
Infobox
Patent Citations Received
‌
US Patent 11837680 Substrate structuring methods
0
Edits on 2 Aug, 2023
"update inverses"
Golden AI profile picture
Golden AI
edited on 2 Aug, 2023
Edits on 19 Jul, 2023
"update inverses"
Golden AI profile picture
Golden AI
edited on 19 Jul, 2023
Edits made to:
Infobox (+1 properties)
Infobox
Patent Citations Received
‌
US Patent 11705365 Methods of micro-via formation for advanced packaging
0
Edits on 14 Jun, 2023
"update inverses"
Golden AI profile picture
Golden AI
edited on 14 Jun, 2023
Edits made to:
Infobox (+1 properties)
Infobox
Patent Citations Received
‌
US Patent 11676832 Laser ablation system for package fabrication
0
Edits on 25 Apr, 2023
"update citations for inverse infoboxes"
Golden AI profile picture
Golden AI
edited on 25 Apr, 2023
"update citations for inverse infoboxes"
Golden AI profile picture
Golden AI
edited on 24 Apr, 2023
Edits on 7 Apr, 2023
"Entity importer update"
Golden AI profile picture
Golden AI
edited on 7 Apr, 2023
Infobox
Is a
Patent
Patent
0
Patent Applicant
Applied Materials
Applied Materials
0
Current Assignee
Applied Materials
Applied Materials
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
105702570
Date of Patent
February 25, 2020
0
Patent Application Number
153529250
Date Filed
November 16, 2016
0
Patent Citations Received
‌
US Patent 11063169 Substrate structuring methods
0
‌
US Patent 11257790 High connectivity device stacking
0
‌
US Patent 11264331 Package structure and fabrication methods
0
‌
US Patent 11264333 Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration
0
‌
US Patent 11342256 Method of fine redistribution interconnect formation for advanced packaging applications
0
‌
US Patent 11362235 Substrate structuring methods
0
‌
US Patent 11398433 Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration
0
‌
US Patent 11400545 Laser ablation for package fabrication
0
‌
US Patent 11404318 Methods of forming through-silicon vias in substrates for advanced packaging
0
‌
US Patent 11417605 Reconstituted substrate for radio frequency applications
0
‌
US Patent 11476202 Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration
0
‌
US Patent 11521935 Package structure and fabrication methods
0
‌
US Patent 11521937 Package structures with built-in EMI shielding
0
Patent Primary Examiner
‌
Ling Siu Choi
0
Edits on 5 Apr, 2023
"update citations for inverse infoboxes"
Golden AI profile picture
Golden AI
edited on 5 Apr, 2023
Edits on 4 Apr, 2023
"update citations for inverse infoboxes"
Golden AI profile picture
Golden AI
edited on 4 Apr, 2023
Edits on 3 Apr, 2023
"update citations for inverse infoboxes"
Golden AI profile picture
Golden AI
edited on 3 Apr, 2023
Edits on 2 Apr, 2023
"update citations for inverse infoboxes"
Golden AI profile picture
Golden AI
edited on 2 Apr, 2023
Edits on 30 Mar, 2023
"update citations for inverse infoboxes"
Golden AI profile picture
Golden AI
edited on 30 Mar, 2023

Find more entities like US Patent 10570257 Copolymerized high temperature bonding component

Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
Open Query Tool
Access by API
Golden Query Tool
Golden logo