Patent 10586765 was granted and assigned to Tokyo Electron on March, 2020 by the United States Patent and Trademark Office.
Aspects of the disclosure provide a semiconductor device and a method for manufacturing the semiconductor device. The semiconductor device includes a power rail formed in an isolation trench. The power rail is covered by a dielectric cap that isolates the power rail from conductive pattern structures on the dielectric cap. Further, an opening is selectively formed in the dielectric cap and is filled with conductive material to selectively connect a conductive pattern structure with the power rail.