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US Patent 10727204 Die stacking for multi-tier 3D integration

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Is a

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Patent attributes

Patent Jurisdiction

United States Patent and Trademark Office

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Patent Number

Date of Patent

July 28, 2020

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Patent Application Number

159915730

Date Filed

May 29, 2018

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Patent Citations Received

US Patent 12113056 Stacked dies and methods for forming bonded structures

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US Patent 11538781 Integrated device packages including bonded structures

US Patent 12068278 Processed stacked dies

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US Patent 12080672 Direct gang bonding methods including directly bonding first element to second element to form bonded structure without adhesive

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US Patent 11462419 Microelectronic assemblies

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US Patent 10930621 Die stacking for multi-tier 3D integration

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US Patent 11631647 Integrated device packages with integrated device die and dummy element

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US Patent 11652083 Processed stacked dies

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