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US Patent 10727204 Die stacking for multi-tier 3D integration

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US Patent 12113056 Stacked dies and methods for forming bonded structures

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US Patent 12080672 Direct gang bonding methods including directly bonding first element to second element to form bonded structure without adhesive

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US Patent 12068278 Processed stacked dies

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US Patent 11955463 Direct bonded stack structures for increased reliability and improved yield in microelectronics

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US Patent 11916054 Stacked devices and methods of fabrication

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edited on 7 Dec, 2023

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US Patent 11837596 Stacked dies and methods for forming bonded structures

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edited on 7 Dec, 2023

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US Patent 11837582 Molded direct bonded and interconnected stack

Edits on 20 Sep, 2023

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edited on 20 Sep, 2023

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US Patent 11764189 Molded direct bonded and interconnected stack

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edited on 20 Sep, 2023

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US Patent 11764177 Bonded structure with interconnect structure

Edits on 24 May, 2023

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edited on 24 May, 2023

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US Patent 11658173 Stacked dies and methods for forming bonded structures

Edits on 19 May, 2023

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edited on 19 May, 2023

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Official Website

https://pdfpiw.uspto.gov/.piw?Docid=107272040

Edits on 17 May, 2023

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edited on 17 May, 2023

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US Patent 11652083 Processed stacked dies

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Golden AI

edited on 19 Apr, 2023

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US Patent 11631647 Integrated device packages with integrated device die and dummy element

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Golden AI

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US Patent 11538781 Integrated device packages including bonded structures

Edits on 28 Dec, 2022

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edited on 28 Dec, 2022

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US Patent 11538781 Integrated device packages including bonded structures

Edits on 8 Oct, 2022

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Golden AI

edited on 8 Oct, 2022

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US Patent 11462419 Microelectronic assemblies

Edits on 28 Sep, 2022

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Golden AI

edited on 28 Sep, 2022

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Is a

Patent

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

107272040

Date of Patent

July 28, 2020

Patent Application Number

159915730

Date Filed

May 29, 2018

Official Website

https://pdfpiw.uspto.gov/.piw?Docid=107272040

Patent Citations Received

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US Patent 10930621 Die stacking for multi-tier 3D integration

Patent Primary Examiner

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Andrew Q. Tran

Edits on 8 Jun, 2022

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Golden AI

edited on 8 Jun, 2022

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Website URL

https://pdfpiw.uspto.gov/.piw?Docid=10727204

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