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US Patent 10727204 Die stacking for multi-tier 3D integration

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
0
Date Filed
May 29, 2018
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Date of Patent
July 28, 2020
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Patent Application Number
15991573
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Patent Citations Received
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US Patent 12113056 Stacked dies and methods for forming bonded structures
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US Patent 11538781 Integrated device packages including bonded structures
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US Patent 12068278 Processed stacked dies
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US Patent 12080672 Direct gang bonding methods including directly bonding first element to second element to form bonded structure without adhesive
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US Patent 11462419 Microelectronic assemblies
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US Patent 10930621 Die stacking for multi-tier 3D integration
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US Patent 11631647 Integrated device packages with integrated device die and dummy element
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US Patent 11652083 Processed stacked dies
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US Patent 11658173 Stacked dies and methods for forming bonded structures
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US Patent 11764177 Bonded structure with interconnect structure
•••
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
10727204
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Patent Primary Examiner
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Andrew Q. Tran
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