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US Patent 10797017 Embedded chip package, manufacturing method thereof, and package-on-package structure

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Edits on 23 May, 2023
"Remove website redirecting to Patent Public Search front page"
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Official Website
https://pdfpiw.uspto.gov/.piw?Docid=107970170
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Website URL
https://pdfpiw.uspto.gov/.piw?Docid=10797017
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 US Patent 10797017 Embedded chip package, manufacturing method thereof, and package-on-package structure

Infobox
Is a
Patent
Patent
Patent jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent number
10797017
Date of patent
October 6, 2020
Patent application number
16283657
Date Filed
February 22, 2019
Patent citations
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US Patent 10163773 Electronics package having a self-aligning interconnect assembly and method of making same
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US Patent 10177103 Fan-out semiconductor package
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US Patent 10199337 Electronic component package and method of manufacturing the same
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US Patent 10256200 Electronic component package and method of manufacturing the same
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US Patent 10262949 Fan-out semiconductor package and method of manufacturing the same
Patent primary examiner
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Earl N Taylor

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