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US Patent 11037831 Gate structure and method
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Patent
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Date Filed
January 8, 2020
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Date of Patent
June 15, 2021
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Patent Application Number
16737447
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Patent Citations
US Patent 10083874 Gate cut method
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US Patent 10157796 Forming of marking trenches in structure for multiple patterning lithography
US Patent 10176995 Methods, apparatus and system for gate cut process using a stress material in a finFET device
US Patent 10177041 Fin-type field effect transistors (FINFETS) with replacement metal gates and methods
US Patent 10217839 Field effect transistor (FET) with a gate having a recessed work function metal layer and method of forming the FET
US Patent 10224204 Method of manufacturing integrated circuit device
US Patent 10347540 Gate cut using selective deposition to prevent oxide loss
US Patent 10388652 Intergrated circuit structure including single diffusion break abutting end isolation region, and methods of forming same
US Patent 10395990 Semiconductor device and method for fabricating the same
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US Patent 10403548 Forming single diffusion break and end isolation region after metal gate replacement, and related structure
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Patent Inventor Names
Kuo-Hua Pan
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Ta-Chun Lin
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Buo-Chin Hsu
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Chih-Yung Lin
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Jhon Jhy Liaw
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Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
11037831
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Patent Primary Examiner
Mohammad M Hoque
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