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US Patent 11270899 Wafer handling chamber with moisture reduction

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
0
Date Filed
May 28, 2019
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Date of Patent
March 8, 2022
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Patent Application Number
16423824
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Patent Citations
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US Patent 10395917 Si precursors for deposition of SiN at low temperatures
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US Patent 10622196 Plasma processing apparatus
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US Patent 10648788 Substrate distance monitoring
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US Patent 10714335 Method of depositing thin film and method of manufacturing semiconductor device
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US Patent 10763139 Vacuum transfer module and substrate processing apparatus
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US Patent 11018003 Method of selective silicon germanium epitaxy at low temperatures
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US Patent 10032628 Source/drain performance through conformal solid state doping
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US Patent 10014212 Selective deposition of metallic films
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US Patent 10017856 Flowable gapfill using solvents
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US Patent 10018920 Lithography patterning with a gas phase resist
•••
Patent Inventor Names
Ward Johnson
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Petri Raisanen
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
11270899
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Patent Primary Examiner
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Glenn F Myers
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