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US Patent 11270899 Wafer handling chamber with moisture reduction

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Patent abstract

An apparatus and method for reducing moisture within a wafer handling chamber is disclosed. The moisture reduction results in reduced oxidation of a wafer. The moisture reduction is made possible through use of valves and purging gas. Operation of the valves may result in improved localized purging.

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Patent Inventor Names
Petri Raisanen0
Ward Johnson0
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Official Website
https://pdfpiw.uspto.gov/.piw?Docid=112708990
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