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US Patent 11380597 Bonded structures

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
0
Date Filed
June 18, 2018
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Date of Patent
July 5, 2022
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Patent Application Number
16011525
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Patent Citations
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US Patent 10026605 Method of reducing residual contamination in singulated semiconductor die
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US Patent 10002844 Bonded structures
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US Patent 10075657 Edgeless large area camera system
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US Patent 10204893 Stacked dies and methods for forming bonded structures
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US Patent 10269756 Die processing
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US Patent 10276619 Semiconductor device structure with a conductive feature passing through a passivation layer
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US Patent 10276909 Structure comprising at least a first element bonded to a carrier having a closed metallic channel waveguide formed therein
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US Patent 10446456 Integrated circuits protected by substrates with cavities, and methods of manufacture
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US Patent 10446487 Interface structures and methods for forming same
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US Patent 10446532 Systems and methods for efficient transfer of semiconductor elements
•••
Patent Citations Received
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US Patent 11978724 Diffused bitline replacement in memory
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US Patent 12068278 Processed stacked dies
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US Patent 12074092 Hard IP blocks with physically bidirectional passageways
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US Patent 12113054 Non-volatile dynamic random access memory
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US Patent 12113056 Stacked dies and methods for forming bonded structures
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US Patent 11694925 Diffusion barrier collar for interconnects
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US Patent 11881454 Stacked IC structure with orthogonal interconnect layers
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US Patent 11621246 Diffused bitline replacement in stacked wafer memory
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US Patent 11894345 Integrated voltage regulator and passive components
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US Patent 11916054 Stacked devices and methods of fabrication
0
•••
Patent Inventor Names
Liang Wang
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Rajesh Katkar
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
11380597
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Patent Primary Examiner
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Jaehwan Oh
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CPC Code
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H01L 23/26
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H01L 24/05
0
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H01L 27/085
0
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H01L 23/10
0

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