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US Patent 11626363 Bonded structures with integrated passive component

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
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Date Filed
December 28, 2017
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Date of Patent
April 11, 2023
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Patent Application Number
15856391
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Patent Citations
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US Patent 11256004 Direct-bonded lamination for improved image clarity in optical devices
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US Patent 11069734 Image sensor device
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US Patent 11176450 Three dimensional circuit implementing machine trained network
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US Patent 11264357 Mixed exposure for large die
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US Patent 11276676 Stacked devices and methods of fabrication
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US Patent 11329034 Direct-bonded LED structure contacts and substrate contacts
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US Patent 11348898 Systems and methods for releveled bump planes for chiplets
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US Patent 11355443 Dielets on flexible and stretchable packaging for microelectronics
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US Patent 10002844 Bonded structures
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US Patent 10026605 Method of reducing residual contamination in singulated semiconductor die
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•••
Patent Citations Received
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US Patent 12074092 Hard IP blocks with physically bidirectional passageways
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US Patent 12068278 Processed stacked dies
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US Patent 11967575 Bond enhancement structure in microelectronics for trapping contaminants during direct-bonding processes
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US Patent 11961743 Substrate manufacturing method for realizing three-dimensional packaging
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US Patent 11929347 Mixed exposure for large die
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Patent Inventor Names
Javier A. DeLaCruz
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Belgacem Haba
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Gabriel Z. Guevara
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Ilyas Mohammed
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Laura Wills Mirkarimi
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Rajesh Katkar
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Shaowu Huang
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
11626363
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Patent Primary Examiner
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Arun Ramaswamy
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CPC Code
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H01L 2224/08265
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H01L 2224/32265
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H01L 2924/19011
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H01L 2924/19041
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H01L 2924/19103
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H01G 4/30
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H01G 2/02
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H01G 4/1245
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H01G 4/228
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H01G 4/40
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•••

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