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US Patent 11664280 Semiconductor devices with backside air gap dielectric

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
0
Date Filed
July 26, 2022
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Date of Patent
May 30, 2023
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Patent Application Number
17873903
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Patent Citations
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US Patent 8803316 TSV structures and methods for forming the same
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US Patent 8816444 System and methods for converting planar design to FinFET design
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US Patent 8993380 Structure and method for 3D IC package
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US Patent 9105490 Contact structure of semiconductor device
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US Patent 9281254 Methods of forming integrated circuit package
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US Patent 9372206 Testing of semiconductor chips with microbumps
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US Patent 9425126 Dummy structure for chip-on-wafer-on-substrate
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US Patent 9443783 3DIC stacking device and method of manufacture
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US Patent 9576814 Method of spacer patterning to form a target integrated circuit pattern
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US Patent 9496189 Stacked semiconductor devices and methods of forming same
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•••
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
11664280
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Patent Primary Examiner
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Jack S Chen
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