US Patent 11669957 Semiconductor wafer measurement method and system
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US Patent 11669957 Semiconductor wafer measurement method and system
Article
A method of analyzing a semiconductor wafer includes obtaining a graphic data system (GDS) file corresponding to the semiconductor wafer, using GDS information from the GDS file to provide coordinates of a layout feature of the semiconductor wafer to an electron microscope, using the electron microscope to capture a raw image from the semiconductor wafer based on the coordinates of the layout feature, and performing a measurement operation on the raw image.
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Is a
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
116699570
Date of Patent
June 6, 2023
0Patent Application Number
173777460
Date Filed
July 16, 2021
0Patent Citations
Patent Primary Examiner
CPC Code
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