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US Patent 11705366 Methods for controllable metal and barrier-liner recess

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
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Current Assignee
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Micromaterials, Inc
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Date Filed
June 11, 2021
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Date of Patent
July 18, 2023
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Patent Applicant
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Micromaterials, Inc
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Patent Application Number
17345683
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Patent Citations
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US Patent 7605082 Capping before barrier-removal IC fabrication method
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US Patent 7192803 Method of making a semiconductor chip assembly with simultaneously formed interconnect and connection joint
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US Patent 7279119 Silica and silica-based slurry
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US Patent 7288463 Pulsed deposition layer gap fill with expansion material
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US Patent 7329956 Dual damascene cleaning method
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US Patent 7541297 Method and system for improving dielectric film quality for void free gap fill
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US Patent 8951429 Tungsten oxide processing
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US Patent 9012322 Selective etching of copper and copper-barrier materials by an aqueous base solution with fluoride addition
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US Patent 9117884 Conformal films on semiconductor substrates
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US Patent 9236292 Selective area deposition of metal films by atomic layer deposition (ALD) and chemical vapor deposition (CVD)
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•••
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
11705366
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Patent Primary Examiner
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Michael M Trinh
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CPC Code
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H01L 21/76883
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H01L 21/76825
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H01L 21/76826
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H01L 21/76829
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H01L 21/76832
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H01L 21/76831
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H01L 21/76834
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H01L 21/76847
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H01L 21/76849
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H01L 21/76846
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