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US Patent 11749645 TSV as pad

Overview Structured Data Issues Contributors Activity

Is a

Patent

Date Filed

June 12, 2019

Date of Patent

September 5, 2023

Patent Application Number

16439360

Patent Citations

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US Patent 8841002 Method of room temperature covalent bonding

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US Patent 10276909 Structure comprising at least a first element bonded to a carrier having a closed metallic channel waveguide formed therein

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US Patent 10312275 Single-photon avalanche diode image sensor with photon counting and time-of-flight detection capabilities

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US Patent 10418277 Air gap spacer formation for nano-scale semiconductor devices

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US Patent 10431614 Edge seals for semiconductor packages

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US Patent 10446456 Integrated circuits protected by substrates with cavities, and methods of manufacture

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US Patent 10446487 Interface structures and methods for forming same

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US Patent 10446532 Systems and methods for efficient transfer of semiconductor elements

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US Patent 10707087 Processing stacked substrates

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US Patent 10790262 Low temperature bonded structures

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Patent Citations Received

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US Patent 11967575 Bond enhancement structure in microelectronics for trapping contaminants during direct-bonding processes

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US Patent 12068278 Processed stacked dies

Patent Inventor Names

Cyprian Emeka Uzoh

Rajesh Katkar

Bongsub Lee

Belgacem Haba

Guilian Gao

Laura Wills Mirkarimi

Gaius Gillman Fountain, Jr.

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

11749645

Patent Primary Examiner

CPC Code

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