US Patent 11982944 Method of lithography process and transferring a reticle
Patent 11982944 was granted and assigned to Taiwan Semiconductor Manufacturing Company on May, 2024 by the United States Patent and Trademark Office.
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US Patent 11982944 Method of lithography process and transferring a reticle
Article
Patent abstract
A method of lithography process is provided. The method includes forming a conductive layer over a reticle. The method includes applying ionized particles to the reticle by a discharging device. The method includes forming a photoresist layer over a semiconductor substrate. The method includes securing the semiconductor substrate by a wafer electrostatic-clamp. The method also includes patterning the photoresist layer by emitting radiation from a radiation source via the reticle.
Infobox
Is a
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Che-Chang Hsu0
Chueh-Chi Kuo0
Hsiao-Lun Chang0
Li-Jui Chen0
Po-Chung Cheng0
Tsung-Yen Lee0
Tzung-Chi Fu0
Date of Patent
May 14, 2024
0Patent Application Number
183262100
Date Filed
May 31, 2023
0Patent Citations
Patent Primary Examiner
CPC Code
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