US Patent 12009225 Electrically conductive vias and methods for producing same
Patent 12009225 was granted and assigned to Samtec Inc on June, 2024 by the United States Patent and Trademark Office.
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US Patent 12009225 Electrically conductive vias and methods for producing same
An electrical component is provided by metallizing holes that extend through a glass substrate. The electrical component can be fabricated by forcing a suspension of electrically conductive particles suspended in a liquid medium through the holes. The suspension can be forced into the holes under an air pressure differential such as a vacuum force, a centrifugal force, or an electrostatic force. The liquid medium in the holes can be dried, and the particles can be sintered. The particles can further be packed in the hole. Alternatively or additionally, the particles can be pressed against the outer surfaces of the substrate to produce buttons.
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