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US Patent 12074092 Hard IP blocks with physically bidirectional passageways

OverviewStructured DataIssuesContributors
Is a
Patent
Patent
0
Date Filed
February 10, 2021
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Date of Patent
August 27, 2024
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Patent Application Number
17172756
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Patent Citations
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US Patent 11069734 Image sensor device
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US Patent 11373963 Protective elements for bonded structures
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US Patent 11380597 Bonded structures
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US Patent 11385278 Security circuitry for bonded structures
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US Patent 11387202 Nanowire bonding interconnect for fine-pitch microelectronics
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US Patent 11387214 Multi-chip modules formed using wafer-level processing of a reconstituted wafer
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US Patent 11393779 Large metal pads over TSV
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US Patent 11462419 Microelectronic assemblies
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US Patent 11476213 Bonded structures without intervening adhesive
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US Patent 11515291 Integrated voltage regulator and passive components
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•••
Patent Inventor Names
Javier A. Delacruz
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
12074092
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Patent Primary Examiner
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Herve-Louis Y Assouman
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CPC Code
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H01L 23/528
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H01L 21/185
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H01L 21/187
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H01L 41/312
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G06F 13/4027
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Y02D 10/00
0
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H01L 23/481
0

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