US Patent 12085844 Ultra-thin, ultra-low density films for EUV lithography
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US Patent 12085844 Ultra-thin, ultra-low density films for EUV lithography
Article
Patent abstract
A filtration formed nanostructure pellicle film is disclosed. The filtration formed nanostructure pellicle film includes a plurality of carbon nanofibers that are intersected randomly to form an interconnected network structure in a planar orientation. The interconnected structure allows for a high minimum EUV transmission rate of at least 92%, with a thickness ranging from a lower limit of 3 nm to an upper limit of 100 nm, to allow for effective EUV lithography processing.
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Patent Inventor Names
Marcio D. Lima0
Takahiro Ueda0
Date of Patent
September 10, 2024
0Patent Application Number
182310000
Date Filed
August 7, 2023
0Patent Citations
Patent Primary Examiner
CPC Code
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