US Patent 12130548 Extreme ultraviolet mask with reduced wafer neighboring effect
Patent 12130548 was granted and assigned to Taiwan Semiconductor Manufacturing Company on October, 2024 by the United States Patent and Trademark Office.
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US Patent 12130548 Extreme ultraviolet mask with reduced wafer neighboring effect
Article
Patent abstract
A reticle is provided. The reticle includes a first reflective multilayer (ML) over a mask substrate and a capping layer over the first reflective ML. The reticle also includes a first absorption layer over the capping layer and a second reflective multilayer (ML) over the first absorption layer. The reticle further includes an etch stop layer over the second reflective ML and a third reflective multilayer (ML) over the etch stop layer. In addition, the reticle includes an absorption film pair over the third reflective ML.
Infobox
Is a
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Chia-Jen Chen0
Hsin-Chang Lee0
Huan-Ling Lee0
Wen-Chang Hsueh0
Date of Patent
October 29, 2024
0Patent Application Number
183434930
Date Filed
June 28, 2023
0Patent Citations
Patent Primary Examiner
CPC Code
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