Log in
Sign up
Golden has been acquired by ComplyAdvantage.Read about it here ⟶
‌

US Patent 12132092 Backside vias in semiconductor device

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
0
Date Filed
May 13, 2022
0
Date of Patent
October 29, 2024
0
Patent Application Number
17743992
0
Patent Citations
‌
US Patent 10872820 Integrated circuit structures
0
‌
US Patent 9520482 Method of cutting metal gate
0
‌
US Patent 9536738 Vertical gate all around (VGAA) devices and methods of manufacturing the same
0
‌
US Patent 9576814 Method of spacer patterning to form a target integrated circuit pattern
0
‌
US Patent 9608116 FINFETs with wrap-around silicide and method forming the same
0
‌
US Patent 9812580 Deep trench active device with backside body contact
0
‌
US Patent 10355017 CMOS devices containing asymmetric contact via structures and method of making the same
0
‌
US Patent 10756017 Contact structure and method of forming
0
‌
US Patent 10840146 Structures and SRAM bit cells with a buried cross-couple interconnect
0
‌
US Patent 9209247 Self-aligned wrapped-around structure
0
•••
Patent Inventor Names
Chih-Hao Wang
0
Lin-Yu Huang
0
Cheng-Chi Chuang
0
Li-Zhen Yu
0
Huan-Chieh Su
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
12132092
0
Patent Primary Examiner
‌
David C Spalla
0
CPC Code
‌
H01L 27/1211
0
‌
H01L 29/0653
0
‌
H01L 29/41791
0
‌
H01L 29/4238
0
‌
H01L 29/4933
0
‌
H01L 29/6653
0
‌
H01L 29/66553
0
‌
H01L 29/6656
0
‌
H01L 29/66795
0
‌
H01L 29/785
0
•••

Find more entities like US Patent 12132092 Backside vias in semiconductor device

Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
Open Query Tool
Access by API
Golden Query Tool
Golden logo