Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
October 19, 2010
Patent Application Number
12368027
Date Filed
February 9, 2009
Patent Citations Received
Patent Primary Examiner
Patent abstract
A composite structure for microlithography, in particular a holding device for a wafer, has two or more components, the surfaces of which are bonded together at least at one bond. At least one of the components consists of cordierite (Mg2Al4Si5O18) or of silicon carbide (SiC). Also disclosed is an optical arrangement, in particular a projection illumination apparatus for microlithography, having at least one such composite structure, preferably a wafer stage.
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