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US Patent 7843052 Semiconductor devices and fabrication methods thereof

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
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Date Filed
November 13, 2008
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Date of Patent
November 30, 2010
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Patent Application Number
12270690
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Patent Citations Received
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US Patent 12113056 Stacked dies and methods for forming bonded structures
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US Patent 11916054 Stacked devices and methods of fabrication
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US Patent 11955463 Direct bonded stack structures for increased reliability and improved yield in microelectronics
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US Patent 12068278 Processed stacked dies
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US Patent 12080672 Direct gang bonding methods including directly bonding first element to second element to form bonded structure without adhesive
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US Patent 11658173 Stacked dies and methods for forming bonded structures
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US Patent 11764189 Molded direct bonded and interconnected stack
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US Patent 11837582 Molded direct bonded and interconnected stack
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US Patent 11837596 Stacked dies and methods for forming bonded structures
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Patent Inventor Names
Ki Wook Lee
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Min Jae Lee
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Min Yoo
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
7843052
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Patent Primary Examiner
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Nathan W Ha
0

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