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US Patent 8664124 Method for etching organic hardmasks
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Patent
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Date Filed
February 13, 2012
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Date of Patent
March 4, 2014
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Patent Application Number
13372363
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Patent Citations Received
US Patent 12125711 Reducing roughness of extreme ultraviolet lithography resists
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US Patent 11921427 Methods for making hard masks useful in next-generation lithography
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US Patent 11988965 Underlayer for photoresist adhesion and dose reduction
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US Patent 12062538 Atomic layer etch and selective deposition process for extreme ultraviolet lithography resist improvement
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US Patent 12105422 Photoresist development with halide chemistries
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US Patent 11837441 Depositing a carbon hardmask by high power pulsed low frequency RF
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Patent Inventor Names
Wesley P. Graff
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Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
8664124
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Patent Primary Examiner
Shamim Ahmed
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