Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Szu-Ying Chen0
Dun-Nian Yaung0
Date of Patent
April 12, 2016
0Patent Application Number
143026660
Date Filed
June 12, 2014
0Patent Citations Received
...
Patent Primary Examiner
Patent abstract
A package component includes a surface dielectric layer having a first planar surface, and a metal pad in the surface dielectric layer. The metal pad includes a diffusion barrier layer that includes sidewall portions, and a metallic material encircled by the sidewall portions of the diffusion barrier layer. The metallic material has a second planar surface level with the first planar surface. An air gap extends from the second planar surface of the metallic material into the metallic material. An edge of the air gap is aligned to an edge of the metallic material.
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