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US Patent 9312229 Hybrid bonding with air-gap structure

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
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Date Filed
June 12, 2014
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Date of Patent
April 12, 2016
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Patent Application Number
14302666
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Patent Citations Received
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US Patent 12136605 Layer structures for making direct metal-to-metal bonds at low temperatures in microelectronics and method for forming the same
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US Patent 12080672 Direct gang bonding methods including directly bonding first element to second element to form bonded structure without adhesive
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US Patent 12113056 Stacked dies and methods for forming bonded structures
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US Patent 12113054 Non-volatile dynamic random access memory
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US Patent 12125784 Interconnect structures
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US Patent 12132020 Low temperature bonded structures
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US Patent 11710718 Structures and methods for low temperature bonding using nanoparticles
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US Patent 11715730 Direct-bonded LED arrays including optical elements configured to transmit optical signals from LED elements
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US Patent 11749645 TSV as pad
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US Patent 11756880 Interconnect structures
•••
Patent Inventor Names
Szu-Ying Chen
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Dun-Nian Yaung
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
9312229
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Patent Primary Examiner
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Victoria K. Hall
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