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US Patent 9620481 Substrate bonding with diffusion barrier structures

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
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Date Filed
May 19, 2015
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Date of Patent
April 11, 2017
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Patent Application Number
14716300
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Patent Citations Received
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US Patent 12136605 Layer structures for making direct metal-to-metal bonds at low temperatures in microelectronics and method for forming the same
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US Patent 12068278 Processed stacked dies
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US Patent 12074092 Hard IP blocks with physically bidirectional passageways
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US Patent 12080672 Direct gang bonding methods including directly bonding first element to second element to form bonded structure without adhesive
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US Patent 12113056 Stacked dies and methods for forming bonded structures
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US Patent 12113054 Non-volatile dynamic random access memory
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US Patent 12125784 Interconnect structures
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US Patent 12132020 Low temperature bonded structures
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US Patent 11710718 Structures and methods for low temperature bonding using nanoparticles
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US Patent 11715730 Direct-bonded LED arrays including optical elements configured to transmit optical signals from LED elements
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•••
Patent Inventor Names
Tuan A. Vo
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Wei Lin
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Daniel C. Edelstein
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Deepika Priyadarshini
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Douglas C. La Tulipe, Jr.
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Kevin R. Winstel
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Spyridon Skordas
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
9620481
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Patent Primary Examiner
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Khiem D Nguyen
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