Patent 9718098 was granted and assigned to Butterfly Network, Inc. on August, 2017 by the United States Patent and Trademark Office.
CMOS Ultrasonic Transducers and processes for making such devices are described. The processes may include forming cavities on a first wafer and bonding the first wafer to a second wafer. The second wafer may be processed to form a membrane for the cavities. Electrical access to the cavities may be provided.