Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
August 15, 2017
Patent Application Number
14206248
Date Filed
March 12, 2014
Patent Citations Received
0
...
Patent Primary Examiner
Patent abstract
A package includes a device die, a molding material molding the device die therein, a through-via substantially penetrating through the molding material, wherein the through-via has an end. The end of the through-via is tapered and has rounded sidewall surfaces. The package further includes a redistribution line electrically coupled to the through-via.
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