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US Patent 9735134 Packages with through-vias having tapered ends

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
Date Filed
March 12, 2014
Date of Patent
August 15, 2017
Patent Application Number
14206248
Patent Citations Received
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US Patent 12087679 Package core assembly and fabrication methods
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US Patent 11931855 Planarization methods for packaging substrates
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US Patent 11935804 Integrated circuit package and method
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US Patent 11705365 Methods of micro-via formation for advanced packaging
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US Patent 11715700 Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration
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US Patent 11837680 Substrate structuring methods
0
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US Patent 11854921 Integrated circuit package and method
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US Patent 11862546 Package core assembly and fabrication methods
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US Patent 11881447 Package core assembly and fabrication methods
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US Patent 11887934 Package structure and fabrication methods
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•••
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
9735134
Patent Primary Examiner
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S. V. Clark

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