Log in
Sign up
Golden has been acquired by ComplyAdvantage.Read about it here ⟶
‌

US Patent 9818729 Package-on-package structure and method

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
Date Filed
June 16, 2016
Date of Patent
November 14, 2017
Patent Application Number
15184843
Patent Citations Received
‌
US Patent 12113056 Stacked dies and methods for forming bonded structures
0
‌
US Patent 12068278 Processed stacked dies
0
‌
US Patent 12080672 Direct gang bonding methods including directly bonding first element to second element to form bonded structure without adhesive
0
‌
US Patent 11764189 Molded direct bonded and interconnected stack
‌
US Patent 11837596 Stacked dies and methods for forming bonded structures
0
‌
US Patent 11837582 Molded direct bonded and interconnected stack
0
‌
US Patent 11916054 Stacked devices and methods of fabrication
0
‌
US Patent 11955463 Direct bonded stack structures for increased reliability and improved yield in microelectronics
0
‌
US Patent 12015739 Integrated customer information user interface
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
9818729
Patent Primary Examiner
‌
A. Sefer

Find more entities like US Patent 9818729 Package-on-package structure and method

Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
Open Query Tool
Access by API
Golden Query Tool
Golden logo